The SMT placement machine can realize fully automatic SMT placement. In the production process of flexible circuit boards, the production efficiency and product qualification rate are greatly improved.
The SMT placement machine can automatically solder various SMT originals to the flexible circuit board.
■ It has a strong ability to identify the deviation of components
Laser recognition mainly captures the shape of the component from the front side, which can reduce the influence of unstable factors such as the electrode shape and color of the chip component, and ensure stable and high-precision recognition.
Reduce defective rate
■ Use component inspection function to improve placement quality
Using laser recognition can monitor the component absorption through the screen before mounting, which can prevent the poor mounting of small components that cannot be recognized by air pressure. Advanced post-mount component inspection and stand piece inspection functions reduce bad mounting.
SOP\QFP\ BGA Function